<Test Technology> Applying infrared thermal imaging technology to measure the surface temperature of electronic components under normal working conditions Yang Jing\(. School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China; 2. School of Mechanical and Manufacturing Engineering, University of New South Wales, Australia) Measurement of component surface temperature. How to obtain the true surface temperature using the infrared camera under normal operating conditions of the electronic components involves the correct estimation of the background temperature and the target temperature, the selection of transparent materials, the estimation of the transmittance, the error and possible correction methods. *:2001-0å±®10 1 Introduction Current infrared thermal imaging technology is rapidly developing. At the same time, thermal control of electronic components has become increasingly important. The application of infrared thermal imaging technology to the surface temperature measurement of electronic components is of great significance to the cooling of electronic systems. Compared with other temperature measurement methods, modern infrared thermal imagers have many advantages. They can perform fast, non-contact, non-invasive temperature measurement and can display the temperature distribution of the measured surface on a thermal image. In addition, its subsequent processing software has multiple functions and can be used for various purposes of analysis and research. As we all know, the current numerical simulation based on computational fluid dynamics (CFD) has been widely used in the thermal evaluation and thermal design of electronic products, but it is necessary to perform some experimental verification on the numerical simulation results. Because the electronic components to be tested are often non-isothermal, the traditional thermocouple temperature measurement sometimes cannot meet the requirements, and the infrared thermal imager can exactly compensate for this defect. Another use of the thermal imager is to directly inspect the components that the printed circuit may overheat under various operating conditions, as well as defective components. Under normal circumstances, the necessary condition for measuring the true temperature by using an infrared camera is to obtain the blackness and background temperature of the surface of the measured object. The temperature measurement of electronic components is more complicated, because components in electronic products are rarely exposed to the outside, but are enclosed in a closed box, so that the thermal imager cannot capture the components to be measured. Some people have tried to infer the real temperature of a component by using a time-reduction method. This method turns off the power, quickly takes out the component to be measured and photographs it, and then theoretically pushes back the true temperature of the component under normal operating conditions according to the temperature of the thermal image. . and also
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